中文

Online
WhatsApp
Email
Top

Smart Card Inlay Multi-Process Compatibility and Substrate Selection Scenario Matching Guide

2025-06-16


With over two decades of technological accumulation in card manufacturing equipment and validation from global market clients, Wenlin Technology's smart card lamination equipment can provide production solutions for Inlays of varying processes. Below, Wenlin Technology will detail the relevant technologies and application scenarios for dual-interface bank card Inlays and contactless smart card Inlays:


1、Dual-interface bank card Inlay


Definition: A dual-interface bank card inlay is a smart card core component that supports both contact and contactless communication. It is typically embedded within a bank card, enabling data reading either through the chip's contact points or via RFID wireless technology.

Process type:

Conductive Adhesive Inlay: Uses conductive adhesive as the connection material between the antenna and the chip, featuring simple processing and lower cost.  

Coupling Inlay: Achieves the connection between the antenna and the chip through electromagnetic coupling, suitable for high-frequency (HF) applications.  

Copper Sheet Inlay: Uses copper sheets as the antenna material, offering excellent conductivity and high durability.  

Tin Sheet Inlay: Using tin foil as a connecting material, it has good welding performance and reliability.

Bravo process: May be a specific packaging or connection process .

Application: mainly used for financial payment cards (such as dual interface credit card, debit card), transportation cards, etc.


2、Contactless smart card Inlay


Definition: The core component of a smart card that only supports contactless communication (RFID/NFC) and can read and write data without physical contact. 

Process type: May include processes similar to those of the double interface Inlay (such as conductive glue, coupling, etc.), but only designed for non-contact functions. 

Application: access card, bus card, membership card, etc.


3、Classification of raw materials


base material :

PVC (polyvinyl chloride): Common in ordinary cards, low cost, but poor environmental protection.

RPVC (recycled PVC): environmentally friendly material made from recycled PVC.

PETG (polyethylene terephthalate glycol-modified): good transparency, impact resistance, suitable for personalized design.

PC (polycarbonate): High strength, high temperature resistant, used for high durability cards (such as ID cards).

PET (polyethylene terephthalate): commonly used in films or special cards, excellent mechanical properties.

Other materials: conductive glue, copper foil, tin sheet and so on are used for antenna and chip connection.


4、Process comparison


Conductive Inlay: low cost, simple process, but long-term stability may be poor for low-cost cards and short-term applications.

Coupled Inlay: Electromagnetic coupling is dependent, suitable for high frequency (13.56MHz), and stable signal transmission HF RFID cards (such as NFC).

Copper Inlay: Good conductivity, high durability, but high cost durable cards (such as transportation cards).

Tin Inlay: strong welding, high reliability, suitable for harsh environment financial card, ID card.


5、Application scenario suggestions


Financial payment field: priority is given to double interface tin or copper Inlay to ensure high reliability and security.

Public transportation, access control: non-Contact Inlay (coupling or conductive adhesive process) can meet the requirements and take into account the cost.

Environmental protection requirements: RPVC or PETG base material is selected.


下一篇 暂无数据